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ATP Introduces Configurable Embedded SSDs at 2017 FMS Event











Taipei, Taiwan (August, 2017) - ATP introduces Dynamic Overprovisioning (OP) and Mid-Density configurable SSD that offers end users the flexibility to tailor-made Embedded SSDs for an array of task-oriented embedded applications and workloads; ATP will reveal these new solutions at the Flash Memory Summit 2017 from August 8th  to 10th , at the Santa Clara Convention Center, meeting room #205.

Embedded applications often require very different workloads and performance metrics. While other industrial memory suppliers typically set their SSD OP by default at 7% for client drives or 28% for enterprise storage, the lack of flexibility in configuring the OP dynamically may be an in-effective method to use the drive. ATP, in comparison, breaks the norms by offering 7%, 14%, 28%, 35%, and even over 50% OP configurations. ATP’s flexibility in offering Dynamic OP enables end users to easily evaluate and implement embedded SSDs based on various workloads and assess the optimization process of WAI and TBW efficiently during qualification phase or via in-field performance.

In addition to Dynamic OP, Mid-Density SSDs by ATP offer end users an even wider capacity selection from the typical capacities of NAND flash products on the market , such as 64GB, 128GB, 256GB, 512GB, 1024GB (1TB); ATP’s Mid-Density SSDs are uniquely offered in 96GB, 192GB, 384GB, 768GB to position between these standard capacities, enabling the end users to easily match suitable product density according to the application needs and at the same time, save cost.

With ATP’s new product options of Dynamic OP and Mid-Density configurations, end users can devise their SSDs solutions based on the most suitable cost, performance and endurance by matching suitable combinations of OP and product density configuration according to embedded application needs.

Please also join us at Flash Memory Summit’s speaker session: 

  • Topic : Optimizing SSDs for Embedded Applications Using Overprovisioning
    Session 101-B , August 8th , Tuesday from 8:30-9:35 am
  • Presented by Head of Embedded SSD BU, Peter Huang  


  • Topic : Is 3D NAND the Right Technology for Removable Device?  
    Forum M-22 , August 9th , Wednesday from 3:20-4:25 pm
  • Presented by Head of Memory Card BU, Crystal Chang





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